Kelingao insulation thermal conductivity 1600C 1700C 1800C alumina ceramic fiber board

Product Detail

Thermal Conductivity:0.185 (400°C)Cold crushing strength:0.12~0.2MPa
Shrinkage (1800°F, 3 hours):3%(1000℃),3%(1000℃)Supply capacity:500 tons of high thermal insulation and thermal conductivity 1600C 1700C 1800C alumina ceramic fiber per month
Ultimate Strength (≥MPa):Aluminum silicate platethickness:3-100mm
Ultra-thin fiberboard:3-10mmMaterial:Alumina + Silica
density:220-400kg/m3Origin:Hunan, China
grade:HP (high purity)model:XTL0910-01
Operating temperature:1350Package preview:
raw material:ceramic fiber bulkFiber Diameter:3-5 microns
delivery time:7-20 dayslength:600mm, 900mm, 1000mm, 1200mm
width:300 mm, 600 mm, 1000 mmchemical composition:Al2O3, SiO2, ZrO2
payment terms:L/C, Western Union, D/P, D/A, T/T, MoneyGramOperating temperature:1050/1100/1200/1350
Thermal Conductivity:0.185 (400°C)Packaging Details:Outer carton or woven bag, inner plastic bag or according to customer requirements
application:insulationport:any port in China
product name:High temperature insulation ceramic fiber boardbrand:XTL
Product Description

feature
*Excellent thermal shock resistance

*Can be machined, cut and formed
easily

*High rigidity and light weight

*Low thermal conductivity

*Low heat storage
Ceramic fiberboard is a lightweight refractory material processed from aluminum-silicon fiber, and its applicable temperature is as high as 1430C. It is manufactured and designed for thermal applications that require high rigidity, and the thermal insulation performance and wear resistance of ceramic fiber boards are further improved due to higher density. Ceramic fiber board is a vacuum formed product that can resist higher gas velocities than ceramic fiber blankets. It is ideal for lining furnaces, boiler pipes and chimneys due to its low thermal conductivity and low heat storage, which results in shorter cycle times and quicker maintenance for industrial furnaces.

product specification
Alumina content ranging from 40% to 45%
Widely used in metallurgical industry

Typical parameters
describe
standard board
hp motherboard
Harbin
Hertz board
Classification temperature (°C)
1260
1260
1350
1430
color
white
white
white
white
Density (kg/m3)
250/300/360
250/300/360
300/360
300/360
Modulus of rupture (MPa)
≥0.3
≥0.3
≥0.3
≥0.3
Compressive strength (MPa, 10% relative deformation)
0.15/0.25/0.3
0.25/0.3
0.25/0.3
0.25/0.3
Ignition loss (%)
≤6
≤6
≤6
≤6
Permanent linear shrinkage (%)
1000℃×24 hours
≤3.0
1100℃×24 hours
≤3.0
1200℃×24 hours
≤3.5
1350℃×24 hours
≤3.5
Thermal conductivity (W/m·K)
400°C
0.08
0.07
0.07
0.07
600°C
0.11
0.10
0.10
0.09
800℃
0.14
0.14
0.13
0.13
1000℃
0.19
0.19
0.19
0.18
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