Low stress 30920 smooth nickel brightener / smooth nickel additive / even leveling nickel plating brightener

feature:
30920 is an innovative nickel plating additive that produces a bright, white, smooth nickel layer. uniform low stress
Ductile deposits can be used for secondary processing without brittleness. No matter how long the plating time is,
The deposition thickness ratio between HCD and LCD is very small. It is very suitable for the special requirements of sandblasting and brushing, and will not affect the roughness of the base surface. It is also recommended for low-stress uniform coating requirements of new energy electronic products. 30920 is less affected by activated carbon. In fact, continuously filtering the plating solution with a small amount of activated carbon during the production process can maintain better plating performance.

1. Avoid grease, mineral oil, polishing wax, etc. in the electroplated parts and electroplating solution.
Must be completely removed during the cleaning step. Rinsing and acid activation tanks required
Change often.
2. If the electroplating workpiece falls into the electroplating solution, it will slowly corrode and pollute
Plating baths must therefore be removed immediately (especially for zinc castings).
3. When bright nickel is plated after copper plating, the copper plating solution must be kept in good condition.
Always avoid rough copper plating after nickel plating. After copper plating,
The workpiece should be thoroughly cleaned to avoid bringing the copper plating solution into the
nickel plating solution. If the copper plating solution has a wetting agent, the part needs to be wetted.
electrolysis.
4. The plating solution should be kept within the standard range, and then determine the remaining amount
This enables the attribution, elimination and
Simply corrected.
5. After the workpiece enters the plating tank, turn on the current. Avoid when plating
any current interruptions. After nickel plating, the workpiece should be fully rinsed immediately.

Avoid bringing nickel solution into the chrome bath.
6. The nickel plating solution must be kept away from ammonia and ammonia salt. if they enter
Difficult to remove in electroplating bath.
7. Avoid nickel plating solution being polluted by chromium. It begins with dark deposits,
Brittle, then skip plating in recessed areas. If the shelf is used for both nickel and
Chromium plating to avoid the possibility of hidden chrome. Rack damage should be fine
fixed. The various coatings plated on the rack should be stripped from time to time,
Wash thoroughly after removal.
8. Nickel carbonate is required for pH adjustment.
9. Lead pipes, lead liners or other lead pumps shall not be used for bright nickel plating.

optimal
Nickel sulfate 220 - 280 g/l. 250 g/l.
Nickel chloride 40 - 60 g/l. 50 g/l.
Boric acid 40 - 50 g/l. 45 g/l.
30920A Additive 0 - 2 ml/L. add brightness
30920B Additive 8 - 12 ml/l. 10 ml/l.
30019 Wetting agent 0.5 - 1.5 ml/L. 1.5 ml/l.
Cathode current density 2.2 - 11A/dm² 4A/dm²
Anode current density 1.1 - 3.3A/dm² 2.2A/dm²
Voltage 6 - 18V 9.0V
Temperature 55°C - 65°C 60°C
pH 3.6 - 4.5 4.2
Filtration Continuous Filtration
stirring air or mechanical movement